Outsourced Semiconductor Assembly service

JSC NIIET (part of the Element Group of Companies) has launched the assembly line for packaging of integrated circuits and semiconductor devices in plastic packages using modern high-performance equipment. Our aim is to establish a production of high-demand civilian electronic products, and to provide full-cycle modern packaging services, replacing foreign products with domestic ones.
JSC NIIET’s quality management system is certified in accordance to the requirements of GOST R ISO 9001-2015.
The total clean room area of JSC NIIET is 250 m², with the cleanroom class of 10000 (7 ISO according to GOST R ISO 14644-1-2017). A yield ratio of assembly operations is more than 90,0%.
Number of equipment units: 26 units of modern technological and auxiliary equipment, manufactured in 2024.
Automated assembly technology allows to pack ICs into QFP, LQFP; DFN, SOT. TO types of plastic packages.
Assembly production capacity is up to 10 million parts per year;

Production line capabilities:

Wafer dicing on adhesive carrier:
Equipment: Advanced Dicing Technologies tool kit
Technical parameters:
- wafer diameter up to 300 mm;
- wafer thickness from 100 µm to 680 µm +/- 20 µm;
- scribe line (kerf) – min 100 µm;
- dice sizes: from 0,4 x 0,4 mm

Die mounting on adhesive glue:
Equipment: MDDB-LA838 automatic mounting system.
Technical characteristics:
- die mounting accuracy +/- 8 µm;
- die sizes: from 0,5 x 0,5 to 20,0 x 20,0 mm;
- can be used with conductive and insulating adhesives;
- automatic mounting from  wafers with up to 300 mm diameters of.

Internal wire bonding:
Equipment: MD-S838 PLUS automatic semiconductor wire ball bonder:, DAGE 4000 PXY bondtester.
Technical characteristics:
-bonding method: - ultrasonic bonding (wedge-wedge); - thermosonic bonding (wedge-wedge, ball-wedge);
- wire material: Al, Au, Pt, Cu;
- wire diameter: 18 to 40 µm;
- minimum contact pad dimensions: 60 x 70 µm;
- bonding speed: 48ms per 2mm of wire connection;
- number of fuses: up to 24000 (depending on th device design;
- connection accuracy: +/- 3 µm;
- in-line bonding quality control system.

Plastic packaging
Equipment: Nexttool NTAMS-120T Auto molding system
Technical specifications:
- The system is equipped with following auxiliary modules: compound loader, lead frame transport system, alignment unit, preheating unit, visual control function;
- The system is able to work with following types of hermetic packages: TO, DIP, SOT, SOD, SMA, SMB, SMC, QFP, IPM, LED

Lead trimming and leadframe separation
Equipment: NT-TF3000 Automatic Lead Trimming and Separation System
Technical specifications:
- Automatic load/unload system;
- visual control functionality
- separation speed: 65 repetitions/min

Lead forming
Equipment: NT-TF3000 Automatic Lead Forming System
Technical specifications:
-Capable of forming gull-wing leads on following package types: SOT, SOD, DFN, SOP, TSOP, QFP, LQFP

Functional control
Equipment: XI autoloading modular platform for control and measuring
Technical characteristics:
- measurement of static and dynamic parameters of microcircuits (detailed capabilities of the measuring system are provided on request)

Component Packaging
Equipment: MDGS-IPT6900 universal system for packing components in blister tape and JEDEC trays with component sorting capabilities, P-10 tabletop system for packing tubes and JEDEC trays in antistatic bags.
Technical characteristics:
- temperature control regulator
- weaving speed of up to 3600 pcs/hour
- hot pressing/cold sealing function
- packing in 13, 15, 22, 27-inch glued or paper tray
- component count function

The transition to domestic production capacities for packaging will allow us to obtain a wider range of civilian products that meet modern requirements for quality, reliability and costs. Production in Russia will simplify logistics, reduce transportation costs for component shipment to help our customers receive them faster and easier.

Russian-made ICs will become a higher-quality and cheaper alternative to Asian components. All these factors together will contribute to the development of modern and competitive Russian electronics industry, which in turn will help achieve greater independence in high-tech industry.