We have been performing a full range of services on digital microcircuits design for over 55 years
Our institute has a modern packaging line for IC, power RF transistors assembly in all types of ceramic packages.
Modern equipment and qualified personnel allow us to conduct comprehensive testing of electronic components using modern methods.
JSC NIIET (part of the Element Group of Companies) has launched the assembly line for packaging integrated circuits and semiconductor devices in plastic packages using modern high-performance equipment.
We provide mass production of ceramic packages for discrete electronics and metal (Au, Ni) plating services of various components, as well as metal coating thickness measurement (Au on Ni substrate and Ni on Cu substrate).
Mass production of semiconductor wafers with RF bipolar transistor, RF MOSFET transistor, planar and pin diode, MIS capacitor and resistor dice.