The GS Nanotech plant (part of the GS Group) and the Voronezh-based Research Scientific Institute of Electronics (NIIET, part of the Element Group, MOEX: ELMT) announce the completion of packaging for a pilot batch of the dual-core 32-bit K1921VG1T microcontroller in a BGA package. The new version of the microcontroller has been designated as K1921VG10YA. The chip was developed at the request of industrial customers who require compact solutions for high-performance automation systems.
Previously, the advanced Russian microcontroller K1921VG1T with RISC-V architecture was produced only in a 28×28 mm LQFP-208 package. Moving to BGA allows a substantial reduction of the occupied PCB area by up to five times. The compact package expands the microcontroller’s application possibilities in modern electronics, where efficient use of board space is critical.
GS Nanotech developed the chip substrate and performed the packaging operations: die bonding, wire bonding, mold compound encapsulation, ball placement on the back of the chip, and marking. All processes were completed successfully, and the high packaging yield confirmed the readiness of NIIET and GS Nanotech for mass production of the chips in the new package design.
“NIIET, together with GS Nanotech, offers a solution that meets the demands of customers working with automation systems and embedded electronics. Every millimeter on the board matters to them. The new 13×13 mm BGA216 package significantly reduces the space occupied by the microcontroller while maintaining its performance. For NIIET, this expands the application possibilities of our flagship product,” commented Pavel Kutsko, General Director of NIIET.
GS Nanotech is capable of successfully and quickly launching new products into production with subsequent transition to mass production status. “We have confirmed the capability of mass packaging domestic dies in a modern package design with a high yield. As a result, Russian developers receive not only a high-performance microcontroller but also a fully domestic solution ready for integration into a wide range of devices,” said Alexey Borodastov, Development Director at GS Nanotech.
Earlier, GS Nanotech had already released a pilot batch of the high-performance domestic field-programmable gate array K5591HS1YA in a modern 25×25 mm plastic BGA576 package. Previously, this chip was only available in an expensive ceramic package designed for critical applications. Thanks to GS Nanotech’s expertise in packaging, it has become accessible for mass civilian products without any loss in performance.
Technical Specifications:
The K1921VG1T controller is built on two RISC-V cores running at frequencies up to 204 MHz and supports the lockstep operation mode, which is critical for functional safety systems. It is equipped with 4 MB of Flash memory, 1 MB of SRAM, an integrated gigabit Ethernet 10/100/1000 with PHY, as well as a hardware cryptographic module supporting AES algorithms and Russian encryption standards “Kuznyechik” and “Magma”.
Background Information:
GS Nanotech is one of the leading enterprises in Russia specializing in the development, packaging, and testing of microelectronic products. It is a high-tech center within the “Technopolis GS” innovation cluster (an investment project of GS Group in Gusev, Kaliningrad Region). Today, it is Russia’s largest contract manufacturer of microprocessors for consumer electronics, including System-in-Package (SiP) solutions, which are unique to the Russian market.
GS Group is a Russian investment and industrial holding headquartered in St. Petersburg. The holding’s core competency lies in the development and production of microelectronics and radio-electronics.
The holding’s flagship investment project is the “Technopolis GS” innovation cluster in the town of Gusev, Kaliningrad Region. Since 2008, the cluster has been running a full-cycle production of electronic devices (from chip packaging to final product boxing). It offers a wide range of contract manufacturing services, with capacities enabling the output of up to 20 million microchips and up to 20 million radio-electronic products for various applications per year.
Element Group (MOEX: ELMT) is the leader in the production of domestic electronic components. The Group’s products are utilized in key sectors of the Russian economy, including healthcare, energy, transport, oil and gas extraction, aircraft and shipbuilding, as well as the space industry. The Group includes more than 30 design centers and production facilities, manufacturing over 3,000 product types. Element Group launched its IPO in May 2024. In January 2026, Sber joined the company’s shareholders.
NIIET is one of the leading manufacturers of electronic components in Russia. Established in 1961, it is one of the oldest domestic design schools, possessing large production capacities and highly qualified personnel. Today, NIIET is the only enterprise in Russia engaged in the mass production and supply of GaN-on-Silicon transistors. NIIET performs a full cycle of design work for digital and analog integrated circuits, power and RF transistors, as well as blocks based on them. The institute operates a modern assembly line for integrating circuits, power and RF transistors in all types of metal-ceramic packages.
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